ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,962, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,963, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "IC package with dummy die heat spreader" was... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,964, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and manufacturing... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,965, issued on June 23, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan). "Bonded body, ceramic circuit substrate, and semicond... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,966, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Hiroyuki Nakamura (Tokyo)... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,967, issued on June 23, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Seal rings for a wide band-gap semiconductor layer stack"... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,968, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method for... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,969, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Geunw... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,970, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Yongk... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,971, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "High-frequency semiconductor package" was invented by Tetsunari... Read More